Job Summary: 1. New Package Technology and New Platform Module Development o Responsible for new package/technology development following Advanced Product Qualification Plan (APQP). o Good understanding of MRS and generate PRS with SCD definition. o Responsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal. o Familiar with DFM, to secure robust manufacturability with quality requirements. o Good understanding of power module package design rule, design rule update with new platform development. o Generate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.). o Planning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.). o Drive problem solving methodology with risk assessment to find technical issue and provide systematic solution. o Strong knowledge and in-depth understanding of device-package inter****. o Effectively working with team for on time development. 2. Technical Project Management and Communication o Responsible for defining and ensuring adherence based on technical requirement, quality requirement, project timing and cost. o Strong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition. o Supporting to track and remind team members for tasks, deliverables, milestones of projects, successfully work with PM to be developed on time. o Participate in all project/gate review, alignment with team. Qualifications1. At least 7 + years working experience in SMT/ Die attach/ Ag sintering, WB/ DS is a plus. o Experienced areas: Power module package (transfer molded, gel filled) development, DSC experience is plus. o Experienced packages: Transfer molded power module (Intelligent Power Module, Case Module, DSC experience is plus). 2. Education: BS or MS degree. 3. Skills: o Fluent with English communicationo familiar with statistical SW (JMP, Minitab), Auto-CAD and MS-office (ppt presentation). 4. Personal characteristics: self-motivated, independent, open mind to communicate, willing to take risk and managing. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a continued focus on the automotive and industrial end-markets, onsemi is accelerating change and driving disruptive innovation towards a sustainable ecosystem in high-growth megatrends such as vehicle electrification, advanced safety, ****native energy, and factory automation. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Today, the industrial and automotive end-markets are responsible for two-thirds of global greenhouse gas emissions, providing an immense opportunity for onsemi to do its part in achieving a net-zero economy with its intelligent power and sensing technologies. Climate change presents not only a risk to the environment, but also opportunities for innovative business solutions, and onsemi is committed to applying its research and design expertise and adapting its own operations to achieve net-zero emissions by 2040.

安森美（onsemi, 纳斯达克股票代码: ON)正推动颠覆性创新，帮助建设更美好的未来！公司专注于汽车和工业终端市场，正加速推动大趋势的变革，包括汽车功能电子化和安全、可持续能源网、工业自动化以及5G和云基础设施等。 安森美总部位于美国亚利桑那州凤凰城，在全球范围内拥有约30,000名员工，公司在北美、欧洲和亚洲拥有设计中心、解决方案工程中心和制造工厂。 安森美坚持并践行对道德、环境可持续性和负责任的商业实践的承诺。 安森美苏州工厂，即快捷半导体（苏州）有限公司，是安森美在中国设立的一家封装与测试工厂，成立于2002年2月。苏州工厂主要产品有分立器件，智能模块，汽车模块和汽车高功率模块。除制造职能外，苏州工厂还设有产品与测试研发中心，封装工艺研发，可靠性和失效分析试验室。 2020年至2024年，苏州工厂连续5年荣获“大苏州最佳雇主”！