Duties and Responsibilities•Responsible for P-Line machine operation and multi-function capability, like wafer sawing, SMT, Die bonding, Wire bonding and related measurement system.•Responsible for P-Line material management and cost reduction.•Responsible for P-Line area 5S.•Improves P-Line techniques, introduces new process / equipment /fixtures to production.•Interfaces with production and other engineering &amp support groups including product and manufacturing to ensure the most efficient processing techniques.•Interfaces with QA and Purchasing regarding material quality and vendor performance.•Maintain cost effectiveness related to materials, process and packaging.•Performs other related job functions as required.Qualifications•Education: Minimum 2yrs collage graduate or equivalent institute graduated.•Specialized knowledge: basic semiconductor assembly and process knowledge.•Skills: Familiar one more process of Yamaha SMT, Disco wafer sawing, Musashi dispensing, KnS wire bonding. •Other characteristics such as personal characteristics : Self motivated, independent, open mind to communicate, be willing to take risk•Experience : 2-5yrs semiconductor related experience.•Familiar with SMT process is preferred.

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