ROLE PURPOSE:工作描述:Interface and facilitate engineering engagement, technical representation with potential new customers for new package and device qualification.Understand the customer specifications and verify the Assembly Process capability to ensure finish product complies as per customer requirement.Define members of a cross functional team from Process Engineering, Production, Quality Assurance and NPI Team to ensure smooth transfer from design conceptualization, prototyping, qualification builds, pre-production to full HVM.Collaborate with Design team for new device, package and perform Technical Risk Assessment to work a mitigation plan with Process Engineering and NPI Engineering team.Provide immediate assistance to any technical information as required by customers thru their inquiries.Drive and manage NPI engineering ****uation, qualification to meet project timeline in coordination with cross functional teams.Responsible to track daily status of customer projects and key issues.Ensure constant feedback on project milestones thru regular conference calls and/or face to face meetings with customers.工作描述:• 与潜在的新客户进行交流并促进工程参与和技术代表，以进行新封装和设备认证。• 了解客户规格并验证装配工艺能力，以确保成品符合客户要求。• 从工艺工程、生产、质量保证和NPI团队中定义跨职能团队的成员，以确保从设计概念化、原型设计、资格认证构建、预生产到完整HVM的顺利过渡。• 与设计团队合作开发新设备、封装并执行技术风险评估，以与工艺工程和 NPI 工程团队合作制定缓解计划。• 根据客户的询问，对客户所需的任何技术信息提供即时帮助。• 与跨职能团队协调，推动和管理 NPI 工程评估、资格认证以满足项目时间表。• 负责跟踪客户项目的日常状态和关键问题。• 通过定期电话会议和/或与客户面对面的会议，确保对项目节点的持续反馈。 KEY TASKS & RESPONSIBILITIES:工作职责:Technical skills and knowledge on assembly packaging.Lead project for New Product Introduction.Review the new device, package design of customer’s enquiries.Plan and organize assembly ****uation for New Product IntroductionPrepare presentation material and compiled technical assembly report for the project.New Project execution thru APQP methodology and update/upload in eNPI system. 主要任务和职责：工作职责:• 装配封装方面的技术技能和知识。• 领导新产品导入项目。• 审查新设备、包装设计的客户咨询。• 计划并组织新产品导入的装配评估。• 为项目准备演示材料和编制技术组装报告。• 通过APQP方法执行新项目，并在eNPI系统中更新/上传。 JOB REQUIREMENTS:任职资格:Bachelor’s Degree in Electronics, Electrical, Mechanical Engineering or related engineering discipline.Over 5 years working experience in related processes in high volume electronics manufacturing environment preferably semiconductor.Knowledge in APQP, DOE, SPC, FMEA and MSA.Apply full understanding of engineering principles in performing job responsibility.Good command in both spoken and written in English and Chinese / Mandarin.Knowledge in Microsoft Office.Able to work with cross functional team and with minimum supervision.Effective interpersonal and communication skills.任职要求：任职资格:• 电子、电气、机械工程或相关工程学科的学士学位。• 5年以上大批量电子制造环境相关工艺工作经验，最好是半导体。• 了解APQP、DOE、SPC、FMEA和MSA。• 在履行工作职责时充分理解工程原理。• 良好的中英文/普通话口语和写作能力。• 了解 Microsoft Office。• 能够与跨职能团队合作，具有工作自主性。• 有效的人际关系和沟通技巧。

As a independent group of companies offering test & assembly services for a broad range of integrated circuits including memory, mixed-signal, analog, logic and memory. 联测优特作为半导体封装测试行业全球排名前列的企业,UTAC集团在集成电路，模拟混合信号，逻辑无线电频率集成电路IC等相关业务范围内占有其独立的一席之地。 UTAC Yantai offers a full range of package and test development, engineering and manufacturing services and solutions to a worldwide customer base, comprising integrated device manufacturers (IDMs), fabless companies and wafer foundries. 公司提供种类齐全的封装测试研发，为客户提供生产制造的相关服务及解决方案，其全球范围内的客户包括完善的设备制造厂，无生产线的公司以及硅片铸造厂等等。